"We are pleased to have achieved this important milestone, which validates the trust our customers have in Syndion's capabilities, not only to address expanding CIS applications, but also to tackle tough TSV integration challenges," said
The market for Syndion's applications is growing with the increasing demand for new products that incorporate CIS devices and TSV structures. Widespread integration of CIS chips in mobile electronics -- for example, cameras in cell phones and tablets -- and for automotive and medical applications continues to fuel demand. To achieve smaller form factors and increase bandwidth for memory chips, TSVs are being integrated into manufacturing for stacked memory designs, such as those used in advanced networking systems and servers. To address requirements for faster data transfer rates, smaller package sizes, and reduced power consumption, TSVs are also being used to connect vertically stacked chips to form 3D ICs. One of the key challenges for transitioning 3D ICs to high-volume manufacturing is achieving a lower overall cost of ownership for integration.
The successful adoption of Syndion products at customers worldwide is a result of their robust design -- built on Lam's market-leading 2300® Kiyo® conductor etch family -- and their optimization for deep silicon etch applications. In particular, Syndion's fast gas switching capabilities enable the industry's highest throughput with superior etch depth and critical dimension (CD) uniformity for both large CD/low aspect ratio and small CD/high aspect ratio structures. These technologies provide the high productivity and process control needed to integrate TSVs into production environments.
Caution Regarding Forward-Looking Statements
Statements made in this press release that are not of historical fact are forward-looking statements and are subject to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Such forward-looking statements relate to, but are not limited to, statements concerning the performance of and demand for Lam's Syndion products, which can vary depending on process and customer application, the demand and applications for new products including semiconductors that incorporate CIS devices and TSV structures as well as products offered by Lam, the challenges affecting adoption of new technologies (such as 3D ICs) for high-volume manufacturing and the role that Lam and its customers may play in addressing those challenges. Such forward-looking statements are based on current beliefs and expectations and are subject to risks, uncertainties and changes in condition, significance, value and effect, including those discussed in Lam's annual report on Form 10-K under the heading "Risk Factors" as well as in other documents filed by Lam with the
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